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Reprocessable, Creep‐Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging

Journal content Created on 16 Sep 2026 Angewandte Chemie Int Ed

Huarui Yao, Chang Jing, Aiqing Dong, Yanyun Li, Xiaoma Fei, Junying Zhang, Jiahao Ma, Jue Cheng

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